Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die

ABSTRACT

A system and method for fabricating distinct types of circuit connections on a semiconductor wafer includes fabricating, using a first photomask, a plurality of a first type of circuit connections for each of a plurality of distinct die of a semiconductor wafer; and fabricating, using a second photomask, a plurality of a second type of circuit connections between a plurality of distinct pairs of components of the semiconductor wafer, wherein each distinct pair of components includes at least one distinct die of the plurality of distinct die and one of a conductive pad and a sacrificial die.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/717,848, filed 17 Dec. 2019, which claims the benefit of U.S.Provisional Application No. 62/782,826, 20 Dec. 2018, each of which isincorporated in its entirety by this reference.

TECHNICAL FIELD

The inventions described herein relate generally to the integratedcircuit architecture and fabrication fields, and more specifically to anew and useful integrated circuit architecture and integrated circuitmanufacturing methods in the integrated circuit architecture field.

BACKGROUND

While the concept of artificial intelligence has been explored for sometime, the modern applications of artificial intelligence have explodedsuch that artificial intelligence is being integrated into many devicesand decision-making models to improve their learning, reasoning, dataprocessing capabilities, and the like of the devices. The most apparentand broad applications of artificial intelligence include machinelearning, natural language processing, computer vision, robotics,knowledge reasoning, planning, and general artificial intelligence.

To be effective, many of the above-noted broad applications ofartificial intelligence require the consumption of extremely large datasets in the initial training of the artificial intelligence algorithms(e.g., deep learning algorithms, recurrent neural networks algorithms,etc.) being implemented in the specific applications and/or devices(e.g., autonomous vehicles, medical diagnostics, etc.). Because the datasets used in training are often very large and the underlying computerarchitecture may not be specifically designed for artificialintelligence training, the training of an artificial intelligencealgorithm may require thousands of hours of data processing by theunderlying computer architecture. While it may be possible to scale orincrease the number of computers or servers used in ingesting data setsfor training an artificial intelligence algorithm, this course of actionoften proves to not be economically feasible.

Similar data processing issues arise in the implementation or executionof the artificial intelligence algorithms due to the large amount ofdata being captured such as data originating from billions of Internettransactions, remote sensors for computer vision, and the like. Themodern remote distributed networked servers (e.g., the cloud) andonboard computer processors (e.g., GPUs, CPUs, etc.) appear to beinadequate for ingesting and processing such great volumes of dataefficiently to maintain pace with the various implementations of theartificial intelligence algorithms.

Accordingly, there is a need in the semiconductor space and specificallyin the computer chip architecture field for an advanced computingprocessor, computing server, or the like that is capable of rapidly andefficiently ingesting large volumes of data for at least the purposes ofallowing enhanced artificial intelligence algorithms and machinelearning models to be implemented. Additionally, these advancedcomputing systems may function to enable improved data processingtechniques and related or similar complex and processor-intensivecomputing to be achieved.

The inventors of the inventions described in the present applicationhave designed an integrated circuit architecture that allows forenhanced data processing capabilities and have further discoveredrelated methods and architectures for fabricating the integratedcircuit(s), packaging the integrated circuit(s), powering/cooling theintegrated circuit(s), and the like.

The below-described embodiments of the present application provide suchadvanced and improved computer chip architecture and related ICfabrication techniques.

BRIEF SUMMARY OF THE INVENTION(S)

In one embodiment, a method for fabricating distinct types of circuitconnections on a semiconductor wafer includes fabricating, using a firstphotomask, a plurality of a first type of circuit connections for eachof a plurality of distinct die of a semiconductor wafer; andfabricating, using a second photomask, a plurality of a second type ofcircuit connections between a plurality of distinct pairs of componentsof the semiconductor wafer, wherein each distinct pair of componentsincludes at least one distinct die of the plurality of distinct die andone of a conductive pad and a sacrificial die.

In one embodiment, the fabrication using the first photomask includes:performing a single-shot exposure of the first photomask to create at asame time the plurality of the first type of circuit connections betweena plurality of distinct pairs of the plurality of distinct die of thesemiconductor wafer.

In one embodiment, the fabrication using the first photomask includes:performing a single-shot exposure of the first photomask to create at asame time the plurality of the first type of circuit connections withineach of the plurality of distinct die of the semiconductor wafer.

In one embodiment, the fabrication using the second photomask includes:performing a single-shot exposure of the second photomask to create at asame time the plurality of the second type of circuit connectionsbetween each of the plurality of distinct pairs of components.

In one embodiment, the first photomask includes a plurality of distinctcircuit connection patterns, wherein each one of the plurality ofdistinct circuit connection patterns corresponds to one of the pluralityof distinct die of the semiconductor wafer; the fabrication using thefirst photomask includes: arranging the first photomask over all theplurality of distinct die of the semiconductor wafer, exposing the firstphotomask and transferring at a same time each one of the plurality ofdistinct circuit connection patterns to a respective one of theplurality of distinct die of the semiconductor wafer.

In one embodiment, the second photomask includes a plurality of distinctcircuit connection patterns along at least one peripheral boundary ofthe second photomask, wherein each one of the plurality of distinctcircuit connection patterns corresponds to one of the plurality ofdistinct pairs of components of the semiconductor wafer; the fabricationusing the first photomask includes: arranging the second photomask overa peripheral region of the semiconductor wafer, exposing the secondphotomask and transferring at a same time each one of the plurality ofdistinct circuit connection patterns to a respective one of theplurality of distinct pairs of components of the semiconductor wafer.

In one embodiment, the plurality of distinct die of the semiconductorwafer include a first column of die along a first peripheral boundary ofthe semiconductor wafer and a second column of die along a secondperipheral boundary of the semiconductor wafer; the second photomaskinclude: a first circuit connection pattern for a first plurality of thesecond type of circuit connections along a first peripheral border ofthe second photomask; a second circuit connection pattern for a secondplurality of the second type of circuit connections along a secondperipheral border of the second photomask; the fabrication using thesecond photomask includes: arranging the second photomask over the firstcolumn of die and the second column of die of the semiconductor wafer,exposing the second photomask and transferring at a same time the firstcircuit connection pattern and the second circuit connection pattern,respectively, to the first column of die and the second column of die ofthe semiconductor wafer.

In one embodiment, the plurality of the first type of circuitconnections the first photomask include: a first circuit connectionpattern for fabricating intra-die circuit connections within each one ofthe plurality of distinct die of the semiconductor wafer; and a secondcircuit connection pattern for fabricating inter-die circuit connectionsbetween distinct pairs of the plurality of distinct die of thesemiconductor wafer.

In one embodiment, the fabrication using the first photomask of theplurality of first type of circuit connections includes: implementing asingle exposure of the first photomask that transfers at a same time thefirst circuit connection pattern and the second circuit connectionpattern to the plurality of distinct die of the semiconductor wafer.

In one embodiment, the method includes exposing the first photomask thatprovides the plurality of the first type of circuit connections; andsubsequently, exposing the second photomask that provides the pluralityof the second type of circuit connections, wherein the plurality of thefirst type of circuit connections are distinct from the plurality of thesecond type of circuit connections.

In one embodiment, the method includes subsequent to the fabrication ofthe plurality of the first type of circuit connections and before thefabrication of the plurality of the second type of circuit connections,performing a circuit testing of the plurality of distinct die of thesemiconductor wafer prior to the fabrication of the plurality of secondtype of circuit connections, wherein the circuit testing includes:measuring a number of functioning die of the plurality of distinct dieof the semiconductor wafer, and computing a functional die yield basedon the number of functioning die.

In one embodiment, the fabrication of the plurality of the second typeof circuit connections is based the functional die yield satisfying orexceeding a yield threshold.

In one embodiment, the plurality of the first type of circuitconnections the first photomask include a circuit connection pattern forfabricating inter-die circuit connections between distinct pairs of theplurality of distinct die of the semiconductor wafer, wherein theinter-die circuit connections communicatively connect distinct pairs ofdie; the fabrication using the first photomask includes exposing thefirst photomask over the plurality of distinct die while thesemiconductor wafer is in an un-diced state, wherein in the un-dicedstate each distinct die of the plurality of die are connected via amaterial of the semiconductor wafer and are not individually severed.

In one embodiment, the method includes reducing a size of thesemiconductor wafer based on a completion of the fabrication of theplurality of the first type of circuit connections and the fabricationof the plurality of the second type of circuit connections.

In one embodiment, reducing the size of the semiconductor wafer includessevering excess material from the semiconductor wafer by cutting througha column of die of the plurality of distinct die of the semiconductorwafer.

In one embodiment, fabricating the plurality of the second type ofcircuit connections includes: fabricating, at each distinct pair ofcomponents, a circuit connection of the second type that extends from afirst region of the semiconductor wafer having a plurality of active dieand one or more second regions of the semiconductor wafer having aplurality of sacrificial die that support a coarse end of the circuitconnection, wherein the plurality of sacrificial die include a pluralityof inactive die arranged along one or more peripheral regions of thesemiconductor wafer.

In one embodiment, the second photomask includes a distinct circuitconnection design that enables a fabrication of circuit connections ofthe second type that extend between a first region of the semiconductorwafer that includes a plurality of active die and one or more secondregions of the semiconductor wafer that include a plurality of inactivedie that define a supporting substrate to one end of each circuitconnection of the second type.

In one embodiment, the circuit connections of the second type comprisefan-out circuit connections, and the plurality of inactive die supportthe fan-out circuit connections.

In one embodiment, a circuit connection design of the first photomaskproduces granular circuit connections along the semiconductor wafer, acircuit connection design of the second photomask produces coarsecircuit connections along the semiconductor wafer, and the coarsecircuit connections produced by the second photomask are larger than thegranular circuit connections of the first photomask.

In one embodiment, a method for fabricating circuits using a mixedexposure of reticles includes: arranging a first reticle over aplurality of die of a wafer, the first reticle including a first circuitpattern for each of the plurality of die of the wafer; implementing asingle exposure of the first reticle that transfer the first circuitpattern to each of the plurality of die of the wafer; subsequently,arranging a second reticle over the plurality of die of the wafer, thesecond reticle including a second circuit pattern for a plurality of diealong one or more peripheral regions of the wafer; and implementing asingle exposure of the second reticle that transfers the second circuitpattern to each of the plurality of die along the one or more peripheralregions of the wafer.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates a schematic of a system 100 in accordance with one ormore embodiments of the present application;

FIG. 2 illustrates a method 200 in accordance with one or moreembodiments of the present application;

FIG. 3A-3D illustrate several schematics of a semiconductor substratewithout and with interconnections in accordance with one or moreembodiments of the present application;

FIG. 4A-4D illustrate several schematics of a semiconductor substrateduring exposure processes and size reduction in accordance with one ormore embodiments of the present application;

FIG. 5 illustrates a semiconductor assembly 500 in accordance with oneor more embodiments of the present application;

FIG. 6A-6B illustrate schematic examples of an elastomeric connector inaccordance with one or more embodiments of the present application; and

FIG. 7 illustrates a method 700 in accordance with one or moreembodiments of the present application; and

FIG. 8 illustrates a schematic of a semiconductor substrate with masksforming connections in accordance with one or more embodiments of thepresent application.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description of preferred embodiments of the presentapplication are not intended to limit the inventions to these preferredembodiments, but rather to enable any person skilled in the art of tomake and use these inventions.

1. Overview 1.1 Die Connectivity

Traditional integrated circuit manufacturers may prepare a singlesilicon wafer with many die formed on the silicon wafer. Once each dieis formed on the silicon wafer, the integrated circuit manufacturer maythen separate each die on the silicon wafer by physically cutting thewafer and having each die separately packaged into a chip. In somecases, the manufacturer may install several of those disparate orseparate chips onto a same printed circuit board (PCB) to form anassembly and provide connections between the disparate chips so thatthey may communicate across the PCB assembly. The communicationconnections between the chips may typically be found in the PCB.However, when a multi-chip PCB is manufactured in this manner, thecommunication between disparate chips thereon becomes limited by theamount connectivity or bandwidth available in each connection betweenthe disparate chips because the chips are in indirect communication viathe PCB. The bandwidth across chips (e.g., off-chip communication)formed on separate pieces of silicon may be multiple orders of magnitudelower compared to chips that remain and communicate on a same piece ofsilicon or die.

The embodiments of the present application provide technical solutionsthat resolve connectivity, communication, and bandwidth issues oftraditional integrated circuits and mainly, arising from integratedcircuits manufactured on separate pieces of silicon (e.g., off-dieintegrated circuits). The technical solutions of the embodiments of thepresent application enable multiple die to be maintained on a same orsingle substrate (e.g., a wafer) without partitioning away each die in awafer cutting process and further, while also establishing directcommunication connectivity between adjacent die on the single substrate.Accordingly, the embodiments of the present application function toprovide die-to-die connectivity on a single substrate or wafer.

The resulting substrate, however, has multiple die and consequentlybecomes a very large computer chip. Therefore, several technicalproblems relating to operational yield of the die on the large chip,packaging of the large chip, and powering/cooling of the large chip mustalso be solved. U.S. Patent Application Ser. No. 62/536,063, which isincorporated by reference herein in its entirety describes technicalsolutions to these related technical problems.

1.2 Packaging and Coefficient of Thermal Expansion Mismatch

As alluded to in section 1.1, the fabrication of multiple die on asingle substrate or wafer produces a very large die or resultingcomputer chip. While the connectivity of the multiple die to form asingle large die on a single substrate and improved bandwidth across thesubstrate may be achieved according to the technical solutions describedin U.S. Patent Application Ser. No. 62/536,063, the very large size ofthe resulting die then gives rise to many technical issues at the systemlevel when packaging the very large die to a PCB, panel, or an organicsubstrate.

The embodiments of the present application, therefore, also provide asystem and method for enabling large silicon die, like those describedin section 1.1 and beyond, to be used in PCBs or organic substrateshaving a non-compliant coefficient of thermal expansion relative to thelarge silicon die.

The technical problem of CTE mismatch arises in the computer chippackaging process results from a difference in the CTE of silicon ontowhich an integrated circuit is fabricated and the CTE of the substrate(e.g., PCB) onto which the silicon is later attached. The mismatch inCTEs of the silicon and the PCB onto which the silicon is attachedresults in the expansion (when powered or heat applied) of the twomaterials at different rates, inducing mechanical stresses, which canlead to damage in the computer chip, usually while in use. Intraditional chip packaging, it is only a single silicon die withcircuitry that is attached to a PCB at a time and the relatively smallsize of the single silicon die may produce a small or negligibleexpansion mismatch with the PCB that the single silicon die is attachedto. For instance, to attach a single silicon die to a PCB, smallmicrobumps are added to a surface of the single silicon die then thesilicon die is affixed to the PCB. When the single silicon die and thePCB expand at different rates due to differences in CTE properties ofthe materials, the microbumps can typically elastically deform andabsorb the small shearing forces produced by the different expansions ofthe PCB and the silicon die. By contrast, when the silicon die is verylarge (e.g., includes multiple die), the microbumps are not capable ofmanaging the large differences in expansion of the large silicon die andthe PCB and thus, the microbumps will become damaged or cracked due tothe excessive displacement of the silicon die relative to the PCB.

Additionally, in the case of a small silicon die, the PCB material maybe selected such that the disparity between the CTE of the silicon dieand the CTE of the PCB are reduced sufficiently for compatibility.

However, the large size of the silicon die of several embodiments of thepresent application exacerbates the problem of CTE mismatch. In someinstances, the large silicon die described herein may be up to eighty ormore times larger than a single silicon die and thus, the expansion ofsuch a large silicon die may be compounded and the resulting expansionmismatch with a PCB onto which the large silicon die is attached issimilarly compounded. Additionally, because the large silicon die may beso great, there are currently no materials that may be selected andcombined to form a PCB and achieve CTE compatibility with the CTE of thelarge silicon die.

To address at least these technical problems, embodiments of the presentapplication provide an elastomeric connector that is disposed betweenthe large silicon die and a PCB or other substrate. The elastomericconnector may be capable of conducting a signal through it while placedunder pressure of the system and may also be malleable. The malleabilityof the elastomeric connector allows for absorption of the shearingdisplacement between the large silicon die and the PCB. U.S. PatentApplication Ser. No. 62/536,071, which is incorporated by referenceherein in its entirety describes technical solutions to these relatedtechnical problems.

1.3 Substrate Securing Mechanism

As introduced in section 1.2, a large elastomeric connector may bepreferable for establishing a connection between a large wafer and acorresponding PCB (or panel). Specifically, one embodiment of thedescribed elastomeric connector includes a large piece of silicon rubberthat is malleable and having a plurality of conductive elements (e.g.,conductive contacts) therein. The plurality of conductive elements inthe elastomeric connector preferably contacts both the PCB and the waferwhen the system when placed under a compression load therebyestablishing signal connectivity between the PCB and the wafer.

The compression of the combination of the wafer, the elastomericconnector, and the PCB is preferably achieved over a large surface ofthe compression system; however, because the wafer is thin and may becomposed of relatively delicate material, the application of thecompression forces for establishing the signal connectivity and also, tosecure together the wafer, the elastomeric connector, and the PCB mustbe carefully applied during assembly and further, maintained after theassembly of the integrated circuit. At least a uniform compressionsystem is proposed by the embodiments of the present application toachieve a required overall system compression after assembly.

In related art or traditional assembly systems, there exist no suchsystem designed for achieving this technical uniform compression.Rather, in traditional IC assemblies, a CPU is assembled to themotherboard by placing the CPU in a socket of the motherboard.Afterward, a large clamping structure may be used to apply a clampingforce to maintain the position of the CPU within the motherboard andfour screws and springs may be applied to secure the CPU to themotherboard around the periphery of the CPU. This traditional process istypically done under compression but the compression is only overparticular surfaces of the motherboard and CPU system. A backing plateusually composed of a strong material, such as steel (or other strongmetal), may be affixed to one side of the motherboard (or PCB) becauseas the system is clamped, the clamping forces generate large opposingcompression forces onto specific sections of the IC assembly that causesthe motherboard to bow. Accordingly, to compensate for the flexibilityof the motherboard, a steel backing plate having significant height orthickness may be added to the system to support or prevent themotherboard from bowing. The backing plate has to extend outside theperiphery of the IC to reach and accommodate the compressing screws andsprings. The backing plate has to be stiffened, and therefore thickened,as the span of compressing screws is extended and/or as the IC size, andtherefore IC perimeter, is increased. The backing plate, therefore,tends to add significant weight and size to the overall structure of theIC because of the thickness and frame width around the IC of the backingplate that is required to resist the clamping forces.

In the embodiments of the present application, because the wafer,elastomeric connector, and PCB are large, significant compression forces(e.g., up to 4 tons or more of compression) may be required to achieveproper assembly and maintained system compression. If a backing plate,as used in the traditional systems were implemented, the backing platewould bow greatly and thus, a significantly larger backing plate havingdouble or more thickness in size than a traditional backing plate wouldbe required to prevent the PCB and IC assembly from bowing. In additionto grossly overweighting the system and increasing the size of thesystem (e.g., height and area) of the system, such a large backing platewould make it difficult to power the integrated circuit as it would bedifficult to provide a power supply structure through such a thickbacking plate.

To address at least these technical problems, embodiments of the presentapplication provide an assembly system that provides a substantiallyuniform compression force across the system (without introducing anoverly thick backing plate), during an assembly step, and that furtherenables a continued uniform compression of the system after assembly ofthe integrated circuit that ameliorates the tensile forces acting on thePCB, that reduces the size and weight of the overall system, and thatenables sufficient or ease of access to power the integrated circuit.

1.4 Precise Fabrication of Orifices

In traditional methods for fabricating a hole in a semiconductor, lasersor other mechanical boring systems may be employed for fabricating thehole during a manufacturing of the semiconductor. The traditionalmethods while useful, in some circumstances, for fabricating holes instandard semiconductors, these traditional methods would fail to produceholes in a large semiconductor substrate (as described herein) with highprecision and without irreparably damaging the semiconductor substrate.

In particular, to support an elastomeric connection between a largesemiconductor substrate (large wafer) with multiple interconnected dieand a substrate (e.g., PCB or the like), the large semiconductorsubstrate may be required to supply a uniform compression across anentire surface area thereof during a securing process. In severalembodiments of the present application, the uniformity requirement maybe achieved with a series of mechanical fasteners arranged across asurface area of the large semiconductor wafer and a wafer clampingsystem to uniformly apply the mechanical fasteners within the largesemiconductor substrate.

Accordingly, the mechanical fastening requirement for securing the largesemiconductor wafer and the substrate necessitated a further requirementto fabricate or drill holes through the large semiconductor substrateand the substrate sufficient to arrange the mechanical fasteningelements. However, none of the traditional methods for fabricating ahole provide a technique that would prevent damage when drilling orfabricating a hole through a plurality of differential materials. Forinstance, while in many circumstances, a laser may be sufficientlyprecise for fabricating a whole in some materials, such as metal, theheat and intensity of a laser or drilling may damage in materials likesilicon including propagating severe cracks or the like along thesilicon material.

To address at least these technical problems, the embodiments of thepresent application provide systems and methods that enable afabrication of a plurality of precise orifices arranged along a surfaceof a large semiconductor without damaging a silicon component of thesemiconductor substrate.

1.5 Hierarchical Exposure of an Integrated Circuit

In fabricating the several distinct connections of a multi-dieinterconnected wafer, a fabrication process may include at leastfabricating the inter-reticle or inter-die connections preferably withone or more first masks that are exposed and that can be recycled orreused along the wafer to achieve many, if not all, of the requiredinter-die or inter-reticle connections. The same one or more first maskstypically cannot be used to achieve the often-required additionalconnections, such as input/output connections and/or any suitableperipheral connections, along one or more edges of the wafer because ofthe coarse pitches that may be associated with such peripheralconnections. That is, the one or more first masks are typically designedwith granular or finer pitches for fabricating finer or smaller-sizedinter-die connections, whereas the peripheral connections that enable aconnection of the wafer to external devices require coarse and/or largerconnections. Therefore, the fabrication of the several connections(described above) required for enabling a suitable multi-dieinterconnected wafer traditionally requires multiple disparate masks anda process with multiple exposures for achieving the several distinctlysized connections along the wafer.

To address at least these technical problems, the embodiments of thepresent application provide systems and methods that enable afabrication of a plurality of distinct connection types along a waferwith a limited number or a single mask thereby eliminating a need forvarying types of masks and multiple exposures for achieving each of theplurality of distinct connection types of a wafer.

2. An IC with Inter-Die Connections and an Elastomeric ConnectorAssembly2.1 IC with Inter-Die Connections

As shown in FIG. 1, a semiconductor 100 illustrates an exampleintegrated circuit having a substrate 110, a plurality of die 120 formedwith the substrate 110, a circuit layer 125, a plurality of inter-dieconnections 130, and scribe lines 140.

The semiconductor 100 may be manufactured using any suitable lithographysystem that is configured to implement the one or more steps of themethods described herein, including method 200.

The semiconductor 100 functions to enable inter-die communicationsbetween the plurality of die 120 formed with the single substrate no.The inter-die connections 130 formed between adjacent die on thesubstrate no improves communication bandwidth and enables a reduction incommunication latency between connected die on the substrate no becausecommunication between each of the plurality of die 120 is maintained ona same large die (e.g., on-die communication). That is, the inter-dieconnections 130 formed between the plurality of die 120 effectivelyeliminate a need to for a first die of the plurality of die 120 to gooff-die (which increases latency due to transmission of signals using anintermediate off-die circuit) to establish communication with a seconddie of the plurality of die 120 since the first and the second die maybe directly connected with one or more inter-die connections or, at aminimum, indirectly connected via intermediate inter-die connectionsestablished between one or more die between the first and the seconddie. Such configuration(s), therefore, enabling increasedly fastercommunications and data processing between die when compared, at least,to communications between die not maintained on a same substrate (e.g.,a same wafer). Each of the plurality of die 120 remain on the singlesubstrate no and are not cut from the substrate no into individual dicefor separate packaging into an individual computer chip. Rather, atformation, only excess die (e.g., die that are not provided withcircuitry or inactive die) along a periphery of the substrate no arepreferably removed from the substrate no and the remaining portions ofthe substrate no having the plurality of die 120 (e.g., active die) mayform a predetermined shape (e.g., a rectangular shape) with thesubstrate no. The resultant substrate no after being reduced to shedexcess die and potentially following one or more additional refinementor IC production processes may then be packaged onto a board (e.g., aprinted circuit board (PCB) or an organic substrate).

The substrate 110 is preferably a wafer or a panel into and/or ontowhich die having a circuitry layer 125 on which microelectronic devicesmay be built. The circuitry layer typically defines one or more surfaceson a die onto which circuits and various microelectronic devices may befabricated using a lithography system. The substrate 110 is preferablyformed of a silicon material (e.g., pure silicon), but may beadditionally or alternatively formed of any suitable material includingsilicon dioxide, aluminum oxide, sapphire, germanium, gallium arsenide,an alloy of silicon and germanium, indium phosphide, and the like. Thesubstrate 110 may be a virgin wafer. Alternatively, the substrate no mayinclude one or more layers formed therein where the one or more layersmay include, but not limited to, a photoresist, a dielectric material,and a conductive material. The photoresist being light-sensitivematerial may include any material that may be patterned by a lithographysystem. The photoresist may be positive photoresist or negativephotoresist.

Accordingly, the substrate no may be formed of any thin slice ofsemiconductor material that may be used for fabrication of integratedcircuits having varying diameters and shapes, but preferably thesubstrate no is formed in a circular shape and with a diameter of 300mm.

The lithography system may refer to any lithography system that printsimages of a reticle onto a substrate (e.g., a wafer) using light. Thelithography system may be a scanning projection system or a step andscan system, which may be alternatively referred to as a scanner or astepper. The lithography system may include any suitable exposure systemincluding one or more of optical lithography, e-beam lithography, X-raylithography, and the like.

The microelectronic devices, such as transistors, diodes, variouscircuits, and the like may be formed into and/or over the substrate nousing lithographic processes (e.g., optical lithography, etc.).

Each of the plurality of die 120 may be a block of semiconductingmaterial on which circuits may be fabricated. Each of the plurality ofdie 120 may be formed by an exposure process of silicon material of oron the substrate no and typically in a rectangular shape or squareshape. However, it shall be noted that the die 120 may take on anysuitable form including any geometric and non-geometric forms. Otherthan excess die that is removed from the substrate no during a substratereduction process, the plurality of die 120 are not cut or diced fromthe substrate no into individual dice.

Additionally, each of the plurality of die 120 includes an alignmentpoint preferably at a center of each die. The alignment point may beused by the stepper of the lithographic system to align the photomaskand/or photoreticle with respect to each of the plurality of die 120before an exposure process. Further, each of the plurality of die 120may include a seal ring surrounding or covering a periphery (perimeter)of each of the die other than the circuitry layer (e.g., circuitfabrication surface) of each dice. Accordingly, the seal ring may beprovided at the side surfaces of each dice which extend in a normaldirection (i.e., perpendicular) with respect to the surface of thesubstrate no and further, located adjacent scribe lines 140. The sealring functions to protect each dice from various contaminants orparticulates that may potentially impregnate or enter a dice.

The plurality of inter-die connections 130 function to connect, atleast, any two circuits (e.g., the inter-die connections may connect atransmitting circuit and receiving circuit of two die, respectively)between two die of the plurality of die 120 on the substrate no. Thatis, each inter-die connection 130 may be formed or provided to extendfrom a first dice to a second dice located on the substrate no.Preferably, an inter-die connection 130 may be formed between twoadjacent die. Each inter-die connection may be formed of a materialhaving a length and an endpoint at each respective end of the length ofmaterial (e.g., two endpoints), where each respective endpointterminates at a circuitry layer of a different dice on the substrate no.

In the case that the die are formed in a rectangular or similargeometric or substantially geometric shape, the inter-die connections130 may extend between two parallel or substantially parallel surfacesof the two-adjacent die. Accordingly, it is possible for a single diceof the plurality of die 120 to be connected to more than one dicedepending on the positioning of the dice in the array of die on thesubstrate no. When positioned in an interior of the substrate no, thesingle dice of the plurality of die 120 may be adjacent to four otherdie having at least one surface that is parallel to one of the four sidesurfaces of the single dice where one or more inter-die connections 130may be formed. It shall be understood that while in preferredembodiments it is described that the die may be formed as a rectangle(or other polygon), the die may be formed in any shape or mannersuitable for preparing an integrated circuit including non-traditional,non-geometric or non-polygonal shapes.

The plurality of inter-die connections 130 (global wires) are preferablywires or traces that function to conduct signals across two die. Theplurality of inter-die connections 130 are preferably formed of a sameconductive material used to form intra-dice connections (or local wires)between circuit elements of a single dice. Additionally, oralternatively, the plurality of inter-die connections 130 may be formedof any suitable conductive material that may be the same or differentfrom materials forming other wires on a dice or that may be the same ordifferent from materials forming the circuits on the dice.

In a preferred embodiment, the plurality of inter-die connections 130are formed by offsetting the stepper of a lithographic system apredetermined distance from a center or alignment point of a single dicesufficiently to allow an exposure to be performed for and between twoadjacent die rather than an exposure focusing on the circuitry layer 125of an individual dice. Consequently, the exposure(s) that provide theinter-die connections 130 may be formed over the scribe lines 140.Additionally, the endpoints of an inter-die connection 130 may bepositioned or formed at interior position relative to a location of theseal ring of a dice. Accordingly, while the inter-die connections 130may be formed at any suitable location between two die, the inter-dieconnections may be typically formed such that the respective endpointsof an inter-die connection 130 are positioned inwardly of the seal ringof the dice on which it terminates such that each respective endpoint ofan inter-die connection 130 is positioned at some location between theseal ring and a center of the respective dice.

The scribe lines 140 (or saw street) function to indicate a locationbetween two disparate die on the substrate 110 where the substrate 110would typically be cut for forming individual dice. The scribe lines 140may typically be centered between two or adjacent die and in many cases,have a width similar to a width of a saw used for cutting wafers and thelike. In a typical circumstance, no circuitry or other elements would beformed on or over the scribe lines 140, as these elements would mostlikely be severed or damaged during a cutting process of the substrateno.

As shown in FIG. 2, a method 200 for producing a large semiconductorhaving a plurality of die and a plurality of inter-die connectionsincludes providing a semiconductor substrate S210, fabricating one ormore circuitry layers on a plurality of die of the substrate S220,fabricating a plurality of inter-die connections S230, and reducing asize of the semiconductor substrate. The method 200 may optionally oralternatively include identifying a largest square of the substrate S215and providing a protective barrier encompassing portions of theplurality of die S225.

Further, FIGS. 3A-3D illustrate several schematics of a semiconductorsubstrate, such as semiconductor 100, without and with interconnections.FIGS. 4A-4D illustrate several schematics of a semiconductor substrate,such as semiconductor 100, during exposure processes and size reduction.

2.2 Elastomeric Connector Assembly

As shown in FIG. 5, a schematic of a semiconductor assembly 500 includesan elastomeric connector 510 disposed between the semiconductor 100 anda circuit board 520.

The elastomeric connector 510 functions to secure the largesemiconductor 100 to a circuit board 520. The elastomeric connector 510preferably functions to place the semiconductor 100 and circuit board520 in operable signal communication by conducting signals between themin a vertical direction (a direction normal to surfaces of both thesemiconductor 100 and circuit board 520). Specifically, each of thesemiconductor 100 and the circuit board 520 may include one or moreconductive pads. The conductive pads of the semiconductor 100 maygenerally oppose the conductive pads of the circuit board 520 and mayalso, have a one-to-one alignment with each other. The elastomericconnector 510 is preferably designed to be interposed between theopposing surfaces of the conductive pads of both the semiconductor 100and the circuit board 520. In this way, signals provided by a conductivepad of either the semiconductor 100 or the circuit board 520 may betransmitted through the elastomeric conductor 510 to an oppositeconductive pad of the other of the semiconductor 100 and the circuitboard 520.

As shown in FIG. 6A, the elastomeric connector 510 includes a membrane620 having a plurality of conductive elements 630. The membrane 620 maybe any suitable material but is preferably made using silicon material.

The plurality of conductive elements 630 may be any suitable conductivematerial that are arranged distributively and/or separately arrangedwithin a body of the membrane 620. The plurality of conductive elementsgenerally include a plurality of particles, such as ball wires, thatwhen placed under compression (e.g., vertical compression) come intoconductive contact with adjacent particles. That is, in a first state(of un-compression) in which the elastomeric connector 510 is not placedunder a compressive load, the plurality of conductive elements 630 arepreferably distributed within the body of the membrane 620 substantially(some contact) or fully independent (no contact) of each other. However,in a second state (of compression) in which the elastomeric connector510 is placed under a compressive load, the plurality of conductiveelements 630 preferably come into contact and may function to formmultiple disparate conductive chains (conductive strings) or electricalpaths from a first surface region of the elastomeric connector 510 to asecond surface region (preferably opposing surface region) of theelastomeric connector 510 that function to electrically connect theconductive pads of the semiconductor 100 and the conductive pads at thecircuit board 520. As shown in FIG. 6B, when under compression, theplurality of conductive elements 630 only make contact vertically andnot horizontally. However, it shall be noted that if a laterallycompressive force were applied to the elastomeric connector 510, theplurality of conductive elements 630 would similarly come into contactto form an electrical signal path between the opposing surface regionsof the elastomeric connector 510.

The plurality of conductive elements 630 may, additionally, function toprovide an elastic effect or spring effect in one or more portions ofthe elastomeric connector 510 to generally resist compressive forces,shearing forces, and/or permanent deformations in the elastomericconnector 510. Accordingly, when one or more portions of the elastomericconnector 510 is placed under a load, the plurality of conductiveelements 630 may elastically compress without allowing the elastomericconnector 510 to undergo permanent deformation. That is, even after alarge load (e.g., four tons of pressure or the like) the plurality ofconductive elements 630 are sufficiently elastic to allow theelastomeric connector 510 to regain its original form or substantiallyits original form when the elastomeric connector 510 is not placed underthe large load.

In the case that the plurality of conductive elements 630 comprise metalball wires, the elastic effect is achieved when a load is placed ontothe elastomeric connector 510 thereby causing the ball wires to comeinto conductive and elastic contact with each other. The ball wires whenin contact form a substantially vertical conductive path (or in someembodiments, a lateral conductive path), as shown by way of example inFIG. 6B. Additionally, or alternatively, a vertical spring or elasticchain in which the adjacent ball wires forming the vertical conductivepath and spring may be permitted to slide against each other in ahorizontal direction (e.g., in a direction normal to a direction of aload) and in the vertical direction (albeit slightly) while maintainingcontinuous contact. In some embodiments, adjacent surfaces of the ballwires, when in contact, are permitted to slide against each other in theconductive and elastic path allows the conductive and elastic path toshift (while maintaining conductive and elastic contact) and form anarc. The arc formed by the ball wires while under a compressive load mayhave varying radii along the arc. Additionally, the arcs formed byhorizontally adjacent vertical conductive and elastic paths may havesimilar or different arcs depending on an amount of load appliedthereon.

The arc-shaped configuration of the ball wires when placed under acompressive load preferably allows for significant deformation (e.g.,beyond some deformation threshold) of the elastomeric connector 510while allowing the ball wires to maintain signal communication betweenthe semiconductor no and the circuit board 520 and also, allow the ballwires to elastically resist variable shearing forces along theelastomeric connector 510 by allowing radii along the signal conductivepath or conductive chain formed thereby to shift or change according tovarying shearing forces applied to the various sections of the signalconductive path. That is, because the semiconductor 100 may expand orcontract at a different rate than the circuit board 520, shearing forcesexperienced along top portion or region of the elastomeric connector 510may be different than the shearing forces experienced along a bottomportion or region of the elastomeric connector 510. Accordingly, theresulting shearing forces experienced along the signal conductive pathformed by the plurality of ball wires (e.g., the plurality of conductiveelements) may also vary from a top region to a bottom region of theelastomeric connector 510.

Further yet, the plurality of conductive elements 630 while undercompression and while maintaining conductive contact function to enablea shearing force absorption effect while maintaining signal conductivitybetween the semiconductor 100 and the circuit board 520. A shearingeffect or shearing force against the elastomeric connector 510 maygenerally be caused by a disparity between the CTE of the circuit board520 and the semiconductor 100. The semiconductor 100 being preferablymade of silicon material typically may not vary greatly, in terms ofexpansion (expands approximately at 3 parts per million) or contraction,during heating or cooling. The circuit board 520, however, which mayinclude materials such as copper may expand and contract at a differentrate (e.g., 17 parts per million). Of course, because the semiconductor100 is large the corresponding circuit board 520 is large so that aheating effect (when powered) applied to the assembly 500 may mainlycauses the circuit board 520 to expand so greatly relative to thesemiconductor 100 on the opposite side of the elastomeric connector 510to cause to a large shearing force and resulting shearing effect on theconnector 510.

However, as mentioned above, the configuration of the ball wires (e.g.,roundness or substantial roundness) allows the balls to shift or slideagainst each other and thereby absorb and resist the shearing forcecaused due to the heating of the circuit board 520 and the semiconductorwith mismatched CTEs.

4. Method of Fabricating Distinct Connection Types of an IntegratedCircuit

As shown in FIG. 7, a method 700 of fabricating a plurality of distinctconnection types of an integrated circuit includes performing a firstfabrication of a first connection type S710, optionally testing a yieldof the die of the wafer S720, performing a second fabrication of asecond connection type S730, and reducing the wafer S740.

The method 700 includes a multistage process for fabricating circuitconnections of various types onto a multi-die semiconductor and also,testing a multi-die semiconductor between distinct circuit connectionfabrication processes. The circuit connections fabricated according tothe method 700 preferably create connectivity that allows signals andpower to come into and out of an active region of a multi-dieinterconnected semiconductor. Accordingly, the method 700 preferablyincludes a hierarchical approach to building circuitry connections usinga mixture of exposures that may be applied in a sequential lithographyprocess.

3.1 Fabricating First Connection Type

S710, which includes implementing a first fabrication of a firstconnection type, may function to implement a first fabrication of atleast a first type of circuit connection within and/or between aplurality of distinct die of a multi-die interconnected semiconductorwafer. The first fabrication of at least the first type of circuitconnection enables and preferably precedes one or more of a circuittesting phase of the plurality of distinct die of the multi-dieinterconnected wafer and a second fabrication phase of at least a seconddistinct connection type.

The at least first type of circuit connection (i.e., first connectiontype) preferably includes one or more granular connections that may beestablished on die. That is, the first connection type(s) established inthe first fabrication may include relatively small or granular (relativeto the coarse second connection type) connections that operate toconnect circuits on each distinct or individual die of a multi-dieinterconnected wafer and may additionally include granular circuitconnections that operate to connect pairs and/or adjacent die of themulti-die interconnected wafer. Accordingly, the first fabricationpreferably includes fabricating a plurality of inter-die connections aswell as a plurality of intra-die connections.

The fabrication of the first connection type may typically be considereda fabrication of on-die circuit connections because the multi-dieinterconnected wafer includes a single continuous (integral) form (die)that includes a plurality of individual die that are physically distinctfrom each other but are arranged within the single continuous form. Thatis, a plurality of distinct die may be formed by processing a singlewafer to create a plurality of die on the single wafer in which theresulting plurality of die may be interconnected using the fabricationsof the first connection type and without dicing or severing theindividual die from a body of the single wafer. Accordingly, each of theplurality of distinct die along the semiconductor wafer are connected atleast via the semiconductor material of the wafer at a time of the oneor more distinct fabrications of circuit connections described herein.

Additionally, S710 may function to fabricate the first connection typealong a multi-die interconnected wafer preferably using a singlephotomask or a single reticle. It shall be noted that any suitablenumber of masks may be used. In a preferred embodiment, a single largemask that covers an area including a plurality of die may be exposed ina (single-shot) lithographic process to form intra-die and inter-dieconnections. A single-shot as referred to herein preferably relates to aprocess of exposing a reticle or a photomask with a single applicationof light. Alternatively, in some embodiments, multiple masks may beimplemented to separately form the intra-die connections and inter-dieconnections, respectively, along the multi-die interconnected wafer. Insuch embodiments, the lithographic process may include multipleexposures to achieve the circuit connections with the multiple masks.

In a first implementation, S710 may function to implement a singlephotomask (i.e., intra-die connection mask) that includes connectiondata and/or a circuit connection design that enables a fabrication ofintra-die (i.e., within an individual die) circuit connections for eachof a plurality of distinct die of a wafer at a same time. That is, S710may function to perform a single shot exposure of the single photomaskfor creating the circuit connections for an active circuitry surface orlayer of each distinct die of a plurality of distinct die of a single,continuous semiconductor wafer.

Further, in the first implementation, S710 may function to implement asecond single photomask (i.e., inter-die connection mask) that includesconnection data and/or a circuit connection design that enables afabrication of inter-die (i.e., between two distinct die) circuitconnection between one or more pairs of a plurality of distinct die of asemiconductor wafer. That is, S710 may function to perform a single shotexposure of the single photomask for creating the circuit connectionsbetween and/or that connection two distinct die of a plurality ofdistinct die of a single, continuous semiconductor wafer.

In a second implementation, S710 may function to implement a singlephotomask that includes connection data and/or a circuit connectiondesign that enables a fabrication of a combination of inter-die circuitconnections and intra-die circuit connection at the same time using asingle exposure.

3.2 Circuit Testing

Optionally, or additionally, 720, which includes testing one or moreattributes of the multi-die interconnected wafer, may function toevaluate and/or test one or more attributes and functionalities of themulti-die interconnected wafer after a completion of the firstfabrication (S710). In particular, a technical benefit achieved in themethod 700 includes that by splitting a fabrication of the connections(i.e., first connection types and second connection types) enables anintermediate testing of a multi-die interconnected wafer for operabilityand/or defects in manufacture. In traditional manufacture of circuitconnections of a die, testing may typically be performed before or afterall circuit connections are made. Thus, it is possible to fabricate allcircuit connections on a die that may be defective. In the context ofthe present application, since the multi-die interconnected waferincludes a plurality of die rather than individual die (as intraditional circuitry), it becomes increasingly technically beneficialand/or technically important to test attributes and functionality of themultiple distinct die midstream of the circuit connection fabricationprocess to avoid downstream fabrication of a multi-die interconnectedwafer with a low yield in a number of functional die on the wafer.

Accordingly, S720 may generally function to test any suitable attributeor feature of a multi-die interconnected wafer. In a preferredembodiment, S720 may function to measure and/or test a yield of themulti-die interconnected wafer. In this preferred embodiment, S720 mayfunction to measure and/or identify a yield of the functional die on themulti-die interconnected wafer. That is, S720 may function to determinea number of the plurality of distinct die on the wafer that are operableand/or functional after the first fabrication compared to the totalnumber of die on the wafer.

In some embodiments, if a measured yield value of a multi-dieinterconnected wafer satisfies and/or exceeds a yield threshold, S720may function to automatically pass the multi-die connected wafer to asubsequent fabrication process (e.g., the second fabrication of circuitconnections). In a preferred embodiment, the yield threshold preferablyrelates to a minimum number of operable and/or successfully tested dieof a multi-die semiconductor wafer. Alternatively, in some embodiments,if a measured yield value of a multi-die interconnected wafer does notsatisfy and/or exceed a yield threshold, S720 may function to ceasefurther fabrication processing of the multi-die interconnected waferand/or revert the wafer for repairs or disposal.

3.3 Fabrication of Second Connection Types

S730, which includes implementing a second fabrication of a secondconnection type, may function to implement a second fabrication of atleast a second type of circuit connection using a distinct reticle orphotomask that enables off-active die connections to external circuits,external sources (e.g., off-chip power sources, peripheral devices,etc.), and/or the like, as shown by way of example in FIG. 8. In someembodiments, the second fabrication of at least the second type ofcircuit connection(s) may be triggered by one or more testing values(e.g., yield) testing values measured in a preceding testing phase.

The at least second type of circuit connection (i.e., second connectiontype) preferably includes one or more coarse connections that mayfunction to connect the on-die elements of a multi-die interconnectedwafer to one or more off-die elements or components. That is, the secondconnection type(s) established in the second fabrication may includerelatively large or coarse circuit connections that operate to connectthe active circuits of the multi-die interconnected wafer to off-dieelements, such as input/output elements, off-die storage elements,energy sources, and the like.

Accordingly, the fabrication of the second connection type(s) maytypically be considered a fabrication of off-die circuit connectionsbecause while the granular circuit connections may include circuitconnections at one end to the (on-die) active circuits and/or active dieof a multi-die interconnected wafer, the opposing end of each granularcircuit connection may be connected to an off-die support or inactivecircuit element, such as a sacrificial die.

One or more examples of second connection types include, but is notlimited to, input/output connections or fan-outs, power distributionsconnections, circuit connections to off-die memory or storage media, andthe like.

Preferably, S730 preferably functions to fabricate a plurality ofgranular and/or off-die circuit connections along one or more peripheraledges or columns of a multi-die interconnected wafer using a singlemasks. In some embodiments, S730 may function to fabricate a pluralityof off-active die circuit connections along a first column and a lastcolumn of a multi-die interconnected wafer. For instance, S730 mayfunction to fabricate I/O connections and power redistributionconnections along the first column and last column of active die of amulti-die interconnected wafer. In other embodiments, S730 may functionto fabricate a plurality of off-active die circuit connections along afirst row and a last row of a multi-die interconnected wafer. It shallbe noted that S730 may function to fabricate off-active die circuitconnections along any or all sides of a multi-die interconnected die.

3.3.1 Sacrificial Die-Supported Fan-Out/Peripheral Connections

As described above, S730 may function to fabricate coarse circuitconnections along one or more peripheral boundaries or regions of amulti-die interconnected wafer based on a lithographic exposure processthat preferably enables a use of a single photomask or the like tocreate connection circuits along a plurality of distinct die of themulti-die interconnected wafer. In a preferred embodiment, the multi-dieinterconnected semiconductor may include at least two distinct regionsincluding a first region of active die and a second region of inactivedie (e.g., sacrificial die, etc.). With respect to the second region,the second region may include one or more peripheral regions (i.e.,boundaries) of the multi-die interconnected wafer. The one or moreperipheral regions preferably include a plurality of inactive die thatmay function as supports or as substrates for one or more circuitconnections including, but not limited to, fan-out connections forconnecting the active die region to peripheral devices (e.g.,input/output devices, etc.), to external devices, to other distinctlayers (e.g., upstream and/or downstream layers) of semiconductorwafers, and/or the like.

Accordingly, with respect to the fabrication of peripheral circuitconnections, such as I/O connections, which may sometimes be referred toherein as fan-out connections, S730 may preferably function to fabricatefan-out circuit connections such that the connections extend from thefirst region of a multi-die interconnected wafer having a plurality ofactive die to the one or more second (peripheral) regions having aplurality of inactive die and/or sacrificial die. That is, in suchembodiments, S730 enables uses the one or more areas beyond theplurality of active die of the wafer to be used to fan-out coarseconnections and use the area beyond defined by the plurality ofsacrificial die and/or inactive die as a substrate or a supportstructure for the coarse connections of the fan-outs.

It shall be noted that in some circumstances distinct and moretime-consuming manufacturing techniques may be used to fabricate thefirst type of connections (i.e., the fine pitch connections) on each dieand to fabricate the second type of connections (e.g., the coarse pitchconnections) that extend from the die to a printed circuit board or thelike. In these type of circumstances, the several coarse connections(e.g., I/O connections or the like) may not fit within a surface area ofa die and thus, are typically extended to another piece of material thatis larger than the die. That is, a separate substrate may be used forsupporting coarse fan-out connections and the like. Accordingly, atleast one technical advantage of the above-described technique of S730becomes apparent in that a same silicon substrate (i.e., the multi-diesemiconductor wafer) on which active integrated circuits are created mayalso be used to create coarse fan-out connections and consequently, aneed for a distinct support substrate to support the coarse fan-outconnections is mitigated or ameliorated completely.

Additionally, or alternatively, the single mask preferably comprises asingle large mask (e.g., a mask that exceeds a size threshold forcovering and enabling an exposure of multiple distinct die at a sametime) that encompasses or covers an area of the multi-die interconnectedwafer that includes the plurality of active interconnected die and areasthat include sacrificial die. Accordingly, the single mask in suchpreferred embodiments may be sufficiently large to enable a lithographicprocess to fabricate all or substantially all off-active die or granularcircuit connections with the single mask and with a single exposure(i.e., a single-shot exposure). A technical benefit of such a largelyconfigured mask includes faster connection circuitry fabricationrelative to traditional fabrication processes that require multiplemasks and therefore, multiple exposures to achieve comparable connectioncircuitry.

It shall be noted that a single mask may include a plurality of distinctoff-active die circuit connection architectures or designs, such that asa result of an exposure of the single mask each of a plurality of sidesof a multi-die interconnected wafer may include distinct off-active diecircuit connections. For example, a first side of the single mask mayinclude a design for fabricating I/O circuit connections on a first sideof a wafer and a second side of the of the single mask may include asecond design for fabricating power redistribution connections on asecond side of the wafer.

It shall also be noted that while it is preferable to implement a singlelarge mask for fabricating the external circuit connections along amulti-die interconnected wafer, it may also be possible to use multiplemasks that may independently be used to fabricate the external circuitconnections along each distinct side of a multi-die interconnectedwafer. For instance, in one example a first mask may be implemented toform external circuit connections along a first and last column of amulti-die interconnected wafer and a second mask may be implemented toform external circuit connections along a first and last row of themulti-die interconnected wafer.

3.4 Wafer Reduction

S740, which includes reducing the wafer, may function to reduce and/orcut through a multi-die interconnected wafer along supports of theoff-active die or granular circuit connections. That is, in a preferredembodiment, once fabrication of the first connection types and thesecond connection types are completed, S740 may function to reduce asize of the multi-die wafer to eliminate excess material and excess die.In such preferred embodiment, S740 may function to reduce the multi-diewafer by cutting through one or more rows and/or one or more columns ofsacrificial die abutting and/or proximate to the active die sections ofthe multi-die wafer.

Specifically, S740 may function to cut through the sacrificial die thatsupports at least one end of each of the off-active die circuitconnections. In this way, a resultant wafer comprising a reducedmulti-die interconnected wafer may include a plurality of sacrificialdie that are partial die (remainder of a full die) and that operate tosupport the plurality of off-active die connections of the wafer. In apreferred embodiment, the sacrificial die are exposed due to the cutmade through the die and therefore, may not support power, may notinclude a seal ring, and/or the like.

It shall be understood that the method 700 is an exemplary method thatmay be implemented in any suitable order to achieve the inventionsand/or embodiments of the inventions within the purview or that may beeasily contemplated in view of the disclosure provided herein. Thus, theorder and process steps should not be limited to the exemplary orderprovided herein.

The methods of the preferred embodiment and variations thereof can beembodied and/or implemented at least in part as a machine configured toreceive a computer-readable medium storing computer-readableinstructions. The instructions are preferably executed bycomputer-executable components preferably integrated with thelithography system and one or more portions of the processors and/or thecontrollers implemented thereby. The computer-readable medium can bestored on any suitable computer-readable media such as RAMs, ROMs, flashmemory, EEPROMs, optical devices (CD or DVD), hard drives, floppydrives, or any suitable device. The computer-executable component ispreferably a general or application specific processor, but any suitablededicated hardware or hardware/firmware combination device canalternatively or additionally execute the instructions.

Although omitted for conciseness, the preferred embodiments includeevery combination and permutation of the various methods, apparatus, andsystems described herein.

As a person skilled in the art will recognize from the previous detaileddescription and from the figures and claims, modifications and changescan be made to the preferred embodiments of the invention withoutdeparting from the scope of this invention defined in the followingclaims.

We claim:
 1. A method comprising: fabricating a plurality of a firsttype of circuit connections for each of a plurality of distinct diewithin a first region of a semiconductor wafer; and fabricating, using aphotomask, a plurality of a second type of circuit connections between aplurality of distinct pairs of components of the semiconductor wafer,wherein each second type of circuit connection comprises a first endsupported by the first region and a coarse end supported by asacrificial die within a peripheral region of the semiconductor wafer.2. The method of claim 1, wherein each distinct pair of componentsincludes at least one distinct die of the plurality of distinct die anda conductive pad.
 3. The method of claim 1, wherein the sacrificial diecomprises inactive die regions of the semiconductor wafer.
 4. The methodof claim 1, wherein the fabrication using the photomask comprises:performing a single-shot exposure of the photomask to simultaneouslycreate the plurality of the second type of circuit connections betweeneach of the plurality of distinct pairs of components.
 5. The methodaccording to claim 1, wherein: the plurality of distinct die of thesemiconductor wafer includes a first set of die along a first peripheralboundary of the first region and a second set of die along a secondperipheral boundary of the first region; and the photomask comprises: afirst circuit connection pattern for a first plurality of the secondtype of circuit connections along a first peripheral border of thephotomask; and a second circuit connection pattern for a secondplurality of the second type of circuit connections along a secondperipheral border of the photomask.
 6. The method of claim 5, whereinfabricating using the photomask further comprises: concurrentlyarranging the photomask over the first set of die and the second set ofdie of the semiconductor wafer; and exposing the semiconductor waferthrough the photomask to simultaneously transfer the first and secondcircuit connection patterns, respectively, to the first and second setsof die.
 7. The method of claim 1, further comprising: determining anumber of functioning die of the plurality of distinct die within thefirst region, wherein the fabrication of the plurality of the secondtype of circuit connections is based the number of functioning diesatisfying a threshold.
 8. The method of claim 1, further comprising:after fabrication with the photomask, reducing a size of thesemiconductor wafer, comprising severing a portion of each sacrificialdie.
 9. The method of claim 8, wherein reducing size of thesemiconductor further comprises: severing a second portion of thesemiconductor along a boundary of the first region, the boundaryarranged along a row of the first type circuit connections.
 10. Themethod of claim 1, wherein the plurality of the second type of circuitconnections comprises fan-out circuit connections.
 11. The method ofclaim 10, wherein the fan-out connections are configured to establishcommunicative connectivity to an off-die circuit.
 12. The method ofclaim 1, wherein the sacrificial die supports a second coarse end of thecircuit connection.
 13. The method of claim 1, wherein the second typeof circuit connections are larger than the first type of circuitconnections.
 14. The method of claim 1, wherein the first type ofcircuit connections comprises: a plurality of intra-die connectionsforming a circuit layer of each die; and a plurality of inter-dieconnections that communicatively connect the circuit layer of each dieto adjacent die of the plurality of distinct die within the firstregion.
 15. A method comprising: simultaneously fabricating a pluralityof granular circuit connections for a plurality of distinct die of asemiconductor wafer, the plurality of distinct die comprising a firstdie; and using a photomask, fabricating a plurality of coarse circuitconnections between a plurality of distinct pairs of components of thesemiconductor wafer, the plurality of distinct pairs of componentscomprising the first die and a conductive pad, wherein the coarsecircuit connections are larger than the granular circuit connections.16. The method of claim 15, wherein the fabrication using the photomaskcomprises: performing a single-shot exposure of the photomask tosimultaneously create the plurality of coarse circuit connectionsbetween each of the plurality of distinct pairs of components.
 17. Themethod of claim 15, wherein the photomask comprises a circuit connectiondesign that enables a fabrication of coarse circuit connections thatextend between a first region of the semiconductor wafer which includesa plurality of active die and one or more second regions of thesemiconductor wafer which comprise a plurality of inactive die regionsthat define a supporting substrate to one end of each coarse circuitconnection.
 18. The method of claim 17, wherein: the coarse circuitconnections comprise fan-out circuit connections, and the plurality ofinactive die regions support the fan-out circuit connections.
 19. Themethod according to claim 15, wherein: the plurality of distinct die ofthe semiconductor wafer includes a first set of die along a firstperipheral boundary of an active die region of the semiconductor waferand a second set of active die along a second peripheral boundary of theactive die region of the semiconductor wafer; and the photomaskcomprises: a first circuit connection pattern for a first plurality ofthe coarse circuit connections along a first peripheral border of thephotomask; and a second circuit connection pattern for a secondplurality of the coarse circuit connections along a second peripheralborder of the photomask.
 20. The method of claim 1, wherein theplurality of granular circuit connections comprises: a plurality ofintra-die connections forming a circuit layer of each die; and aplurality of inter-die connections that communicatively connect thecircuit layer of each die to adjacent die of the plurality of distinctdie.